物料参数
| Product Lifecycle: | 推荐用于新设计 |
| Package: | TQFP 1.0 MM W/ THERMAL PAD |
| # of Amps: | 1 |
| BW -3 dB (typ): | 4.3MHz |
| Slew Rate (typ): | 1.8kV/us |
| Vos (typ): | 4mV |
| Vos (max): | 25mV |
| Vos TC (typ): | 160µV/°C |
| VNoise Density (typ): | 600nV/rtHz |
| Iq/Amp (typ): | 22.5mA |
| Iq/Amp (max): | 26.5mA |
| Vs span (min): | 24V |
| Vs span (max): | 110V |
| PSRR DC (typ): | 93dB |
| Out V+ Headroom (typ): | 5V |
| Out V- Headroom (typ): | 11.1V |
| Shutdown: | Yes |
| Iout (typ): | 1A |
| Amp Features: | Integrated High Voltage High Current DAC + Amplifier |
| Settling Time 0.1% (typ): | 39.5µs p-p |
| Feedback Type: | Fixed Gain |
| Eval / Ref Circuit: | Evaluation board |
| Export Classification: | EAR99 |
| Automotive: | No |
| Temp Range: | -40 to 85°C |
| Package Finish Code: | E3 |
| Launch Date: | 2023-10-27 |
| Terminal Finish: | E3 |
| Temp Range Code: | NA |
| EP: | No |
| Design Tools: | LTspice |